層數(shù)：8
特殊工藝：阻抗線
表面處理：沉金
材料：高TG FR4
外層線寬/線距：3.5/4mil
內(nèi)層線寬/線距：4/3.5mil
板厚：1.0mm
最小孔徑：0.2mm
Product name: 8 Layer High TG Impedance Control Fine Pitch PCB
Number of layers: 8
Surface finish: ENIG
Base material: High TG FR4?
Outer Layer W/S: 3.5/4mil
Inner layer W/S: 4/3.5mil
Thickness: 1.0mm
Min. hole diameter: 0.2mm
Special process: Impedance Control